Categories: Science and Tech

Samsung Electronics says HBM to account for nearly 30% of industry DRAM capacity next year

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TDG Syndication

SEOUL, Sept 29 (Reuters) – A Samsung Electronics executive said on Tuesday that high-bandwidth memory (HBM) is expected to account for nearly 30% of Dynamic Random-Access Memory (DRAM) chipmakers'

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TDG Syndication
Published by TDG Syndication