About Rs 1.25 lakh crore, PM Modi to lay foundations for three semiconductor factories

Prime Minister Narendra Modi is scheduled to engage with and address the youth in the ‘India’s Techade: Chips for Viksit Bharat’ event on March 13 at 10:30 am through video conferencing. During the event, he will lay the foundation stone for three semiconductor projects valued at approximately Rs 1.25 lakh crore, aiming to develop semiconductor and display manufacturing ecosystems in India.

The India Semiconductor Mission, established by the Government of India, aims to create a comprehensive semiconductor ecosystem, positioning India as a leader in the global semiconductor industry. This initiative is expected to generate employment opportunities for the country’s youth, as per a statement from the Ministry of Education.

Prime Minister Modi will inaugurate India’s first Fab facility in Gujarat’s Dholera, as well as Outsourced Semiconductor Assembly and Test (OSAT) facilities in Sanand, Gujarat, and Morigaon, Assam. The event will involve the participation of students from 1814 institutes, including Central Universities, IITs, NITs, IIMs, IISER, IISc, and other leading institutes focusing on research, innovation, and STEM disciplines.

In addition to live streaming of the event, Higher Education Institutions (HEIs) will organize seminars and conferences throughout the day to encourage discussions on India’s Techade vision, the Semiconductor Mission, and a roadmap to achieve Viksit Bharat @2047 through research and innovation.

India’s Techade signifies the country’s commitment to embracing the digital age for sustainable development, job creation, improved quality of life, and establishing a strong presence in the global technology landscape. Prime Minister Modi’s vision is to position India as a global hub for semiconductor design, manufacturing, and technology development, creating employment opportunities for the nation’s youth, as stated in the Prime Minister’s office statement.

Tata Electronics Private Limited (TEPL) will set up the Semiconductor fabrication facility in the Dholera Special Investment Region (DSIR) under the Modified Scheme for setting up Semiconductor Fabs in India, with a total investment exceeding Rs. 91,000 crore. The OSAT facility in Morigaon, Assam, will also be established by TEPL under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP) with a total investment of around Rs 27,000 crore. Additionally, the OSAT facility in Sanand will be established by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with a total investment of about Rs 7,500 crore.