Categories: Business

South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

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TDG Syndication

SEOUL, Nov 12 (Reuters) – South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in

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TDG Syndication
Published by TDG Syndication